US 12,146,220 B2
Apparatus and method for manufacturing semiconductor film
Huaqiang Tan, Shenyang (CN); Mingce Huang, Shenyang (CN); Tingting Zhao, Shenyang (CN); and Jingshu Li, Shenyang (CN)
Assigned to Piotech Inc., Shenyang (CN)
Filed by Piotech Inc., Shenyang (CN)
Filed on Sep. 27, 2021, as Appl. No. 17/485,735.
Claims priority of application No. 202011642967.1 (CN), filed on Dec. 31, 2020.
Prior Publication US 2022/0205102 A1, Jun. 30, 2022
Int. Cl. C23C 16/455 (2006.01); C23C 16/52 (2006.01)
CPC C23C 16/45587 (2013.01) [C23C 16/52 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A film deposition apparatus, comprising:
a chamber;
a spray board arranged at a top of the chamber;
a wafer pocket arranged opposite to the spray board in the chamber;
a pumping part arranged adjacent to an inner side wall of the chamber, wherein the pumping part is configured to ascend or descend in the chamber under driving of a first motor;
a pumping pipe, wherein the pumping pipe is partially located in the chamber and is connected to the pumping part, and the pumping pipe is in communication with an interior of the pumping part; and
a pumping base plate, wherein the pumping part is arranged on the pumping base plate, and the pumping base plate is fixedly connected to the pumping pipe and is provided with a hole corresponding to the pumping pipe, wherein
the pumping base plate is connected to a fixing flange through a screw, and the fixing flange is connected to the pumping pipe through a flange screw.