US 12,146,057 B2
Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board
Hiroyuki Iguchi, Annaka (JP); Masayuki Iwasaki, Annaka (JP); and Naoyuki Kushihara, Annaka (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed by Shin-Etsu Chemical Co., Ltd., Tokyo (JP)
Filed on Dec. 13, 2021, as Appl. No. 17/549,260.
Claims priority of application No. 2020-213136 (JP), filed on Dec. 23, 2020.
Prior Publication US 2022/0195189 A1, Jun. 23, 2022
Int. Cl. C08L 79/08 (2006.01); C08G 73/10 (2006.01); C08J 5/24 (2006.01); C08K 5/5317 (2006.01); C08L 63/00 (2006.01); H05K 1/18 (2006.01)
CPC C08L 79/08 (2013.01) [C08G 73/1067 (2013.01); C08G 73/1075 (2013.01); C08J 5/24 (2013.01); C08K 5/5317 (2013.01); H05K 1/188 (2013.01); C08L 63/00 (2013.01); C08L 2201/08 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); H05K 2201/0355 (2013.01)] 16 Claims
 
1. A cyclic imide resin composition comprising:
(a) a cyclic imide compound represented by the following formula (3), and having a weight-average molecular weight of 3,000 to 500,000,

OG Complex Work Unit Chemistry
wherein A independently represents a cyclic structure-containing tetravalent organic group, Q independently represents an arylene group that may contain a hetero atom(s) and has 6 or more carbon atoms, X represents a hydrogen atom or a methyl group, n is 10 to 300;
(b) a cyclic imide compound represented by the following formula (2), and having a weight-average molecular weight of 200 to 2,000,

OG Complex Work Unit Chemistry
wherein A independently represents a cyclic structure-containing tetravalent organic group, X represents a hydrogen atom or a methyl group, W independently represents a divalent aliphatic hydrocarbon group that may contain a hetero atom(s) and has 5 or more carbon atoms, s is 1 to 10; and
(c) a curing catalyst which is a phosphonium salt comprised of a phosphonium cation and one molecule of an anion residue of a carboxylic acid.