US 12,145,852 B2
Silica spherical particles for semiconductor sealing material
Katsumasa Yagi, Tokyo (JP); Dota Saito, Tokyo (JP); Mutsuhito Tanaka, Tokyo (JP); Masanori Ae, Tokyo (JP); and Hiroyuki Deai, Tokyo (JP)
Assigned to NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., Tokyo (JP)
Appl. No. 17/293,112
Filed by NIPPON STEEL Chemical & Material Co., Ltd., Tokyo (JP)
PCT Filed Nov. 13, 2019, PCT No. PCT/JP2019/044586
§ 371(c)(1), (2) Date May 12, 2021,
PCT Pub. No. WO2020/100952, PCT Pub. Date May 22, 2020.
Claims priority of application No. 2018-213267 (JP), filed on Nov. 13, 2018.
Prior Publication US 2022/0009783 A1, Jan. 13, 2022
Int. Cl. C01B 33/12 (2006.01); C08K 3/36 (2006.01); C09K 3/10 (2006.01)
CPC C01B 33/12 (2013.01) [C08K 3/36 (2013.01); C01P 2004/32 (2013.01); C01P 2004/61 (2013.01); C01P 2006/12 (2013.01); C09K 3/1006 (2013.01)] 8 Claims
OG exemplary drawing
 
1. Silica spherical particles characterized in that, when particles having a size of 5 μm or more and imaged by an optical measurement are observed, the particle diameter of the particles, which is determined from the image, satisfies the following requirements:
D99≤29 μm,
10 μm≤Dmode<D99,
D99/Dmode≤1.5; and
Dmode≤20 μm, wherein a BET specific surface area of the silicia spherical particles is less than 4.0 m2/g.