US 12,145,324 B2
Film-closure apparatus for plastic film material, printed circuit board, and method of enhancing the operation of a film-closure apparatus
Mark Bonning, Bristol (GB)
Assigned to Green Light Packaging Limited, (GB)
Appl. No. 17/438,584
Filed by Green Light Packaging Limited, Cardiff (GB)
PCT Filed Feb. 7, 2020, PCT No. PCT/GB2020/050283
§ 371(c)(1), (2) Date Sep. 13, 2021,
PCT Pub. No. WO2020/183123, PCT Pub. Date Sep. 17, 2020.
Claims priority of application No. 1903440 (GB), filed on Mar. 13, 2019.
Prior Publication US 2022/0134678 A1, May 5, 2022
Int. Cl. B29C 65/22 (2006.01); B29C 65/00 (2006.01); B29C 65/18 (2006.01); B29C 65/78 (2006.01); B65B 51/10 (2006.01); H05B 3/06 (2006.01); H05B 3/26 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01)
CPC B29C 65/225 (2013.01) [B29C 65/18 (2013.01); B29C 65/228 (2013.01); B29C 65/7894 (2013.01); B29C 66/43 (2013.01); B29C 66/73921 (2013.01); B29C 66/849 (2013.01); B29C 66/91313 (2013.01); B29C 66/91315 (2013.01); B29C 66/91423 (2013.01); B65B 51/10 (2013.01); H05B 3/06 (2013.01); H05B 3/267 (2013.01); H05K 1/0212 (2013.01); H05K 1/0346 (2013.01); H05K 2201/0154 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A film-closure apparatus for closing plastic film material using heat, the film-closure apparatus comprising:
a guide path along which at least part of a plastics film material can pass;
a driving mechanism for moving the film material along the guide path; and
a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface;
the electrically conductive heating element being positionable on the guide path to apply heat to the film material thereon; and
the perimeter edge surface comprising four linear edge surface sections, the electrically conductive heating element being provided along one linear edge surface section.