US 12,145,319 B2
Temperature prediction in three-dimensional (3D) parts
Sunil Kothari, Palo Alto, CA (US); Tod Heiles, Sumner, WA (US); Juan Carlos Catana Salazar, Guadalajara (MX); Jun Zeng, Palo Alto, CA (US); and Gary J. Dispoto, Palo Alto, CA (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 17/420,029
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jan. 23, 2019, PCT No. PCT/US2019/014715
§ 371(c)(1), (2) Date Jun. 30, 2021,
PCT Pub. No. WO2020/153950, PCT Pub. Date Jul. 30, 2020.
Prior Publication US 2022/0088879 A1, Mar. 24, 2022
Int. Cl. B29C 64/393 (2017.01); B29C 64/165 (2017.01); B29C 64/188 (2017.01); B33Y 30/00 (2015.01); B33Y 40/20 (2020.01); B33Y 50/02 (2015.01); G06N 3/08 (2023.01)
CPC B29C 64/393 (2017.08) [B29C 64/165 (2017.08); B29C 64/188 (2017.08); B33Y 40/20 (2020.01); B33Y 50/02 (2014.12); G06N 3/08 (2013.01); B33Y 30/00 (2014.12)] 13 Claims
OG exemplary drawing
 
1. A method of predicting temperature during a build of a three-dimensional (3D) part, the method comprising:
determining a temperature profile at a plurality of layers of a part based on at least one geometric characteristic of the 3D part as defined by a 3D part file, wherein the temperature profile is determined by executing either a black-and-white (B/W) ratio analysis, a bounding perimeter ratio analysis, or combinations thereof; and
adjusting a process parameter of the build based on the temperature profile.