US 12,145,220 B2
Solder particles
Kunihiko Akai, Tokyo (JP); Yoshinori Ejiri, Tokyo (JP); Yuuhei Okada, Tokyo (JP); Toshimitsu Moriya, Tokyo (JP); Shinichirou Sukata, Tokyo (JP); and Masayuki Miyaji, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/255,982
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed Jun. 26, 2019, PCT No. PCT/JP2019/025499
§ 371(c)(1), (2) Date Dec. 23, 2020,
PCT Pub. No. WO2020/004513, PCT Pub. Date Jan. 2, 2020.
Claims priority of application No. 2018-121088 (JP), filed on Jun. 26, 2018; and application No. 2019-014853 (JP), filed on Jan. 30, 2019.
Prior Publication US 2021/0114145 A1, Apr. 22, 2021
Int. Cl. B23K 35/02 (2006.01); B22F 1/00 (2022.01); B23K 35/26 (2006.01); B23K 103/08 (2006.01)
CPC B23K 35/0244 (2013.01) [B22F 1/00 (2013.01); B23K 35/262 (2013.01); B23K 2103/08 (2018.08)] 11 Claims
OG exemplary drawing
 
1. A solder particle having:
a flat portion on a part of a surface; and
a curved portion having a spherical crown shape, on the surface other than the flat portion,
a ratio (A/B) of a diameter A of the flat portion to a diameter B of the solder particle satisfies the following formula:
0.01<A/B<1.0.