US 12,145,214 B2
Laser machining head and laser machining device
Takeshi Sakamoto, Hamamatsu (JP); and Junji Okuma, Hamamatsu (JP)
Assigned to HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
Appl. No. 17/288,821
Filed by HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
PCT Filed Oct. 30, 2019, PCT No. PCT/JP2019/042625
§ 371(c)(1), (2) Date Apr. 26, 2021,
PCT Pub. No. WO2020/090912, PCT Pub. Date May 7, 2020.
Claims priority of application No. 2018-203669 (JP), filed on Oct. 30, 2018.
Prior Publication US 2021/0394303 A1, Dec. 23, 2021
Int. Cl. B23K 26/04 (2014.01); B23K 26/03 (2006.01); B23K 26/064 (2014.01); G01B 11/14 (2006.01); G02B 13/22 (2006.01); G02B 27/10 (2006.01)
CPC B23K 26/048 (2013.01) [B23K 26/032 (2013.01); B23K 26/064 (2015.10); G01B 11/14 (2013.01); G02B 13/22 (2013.01); G02B 27/108 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A laser processing head comprising:
a housing including a first wall portion and a second wall portion facing each other in a first direction, a third wall portion and a fourth wall portion facing each other in a second direction orthogonal to the first direction, and a fifth wall portion and a sixth wall portion facing each other in a third direction orthogonal to the first direction and the second direction;
an entrance portion through which a laser light enters the housing, the entrance portion provided to the housing;
an adjustment portion configured to adjust the laser light that has entered through the entrance portion, the adjustment portion disposed in the housing;
a condensing portion configured to condense the laser light that has been adjusted by the adjustment portion, and emit the laser light to outside of the housing, the condensing portion attached to the housing; and
a circuit portion disposed on a side of the third wall portion with respect to the adjustment portion in the housing, wherein
a distance between the third wall portion and the fourth wall portion is shorter than a distance between the first wall portion and the second wall portion,
the housing is configured to be attached to an attachment portion of a laser processing apparatus, with at least one of the first wall portion, the second wall portion, the third wall portion, and the fifth wall portion disposed on a side of the attachment portion,
the condensing portion is disposed on the sixth wall portion, and is offset toward the fourth wall portion in the second direction,
a partitioning wall portion is provided in the housing to partition a region in the housing into a region on a side of the third wall portion and a region on a side of the fourth wall portion,
the adjustment portion is disposed on the side of the fourth wall portion with respect to the partitioning wall portion in the housing,
the circuit portion is disposed on the side of the third wall portion with respect to the partitioning wall portion in the housing, and
a light path from the entrance portion to the condensing portion is disposed on the side of the fourth wall portion with respect to the partitioning wall portion in the housing.