US 12,144,680 B2
Ultrasound imaging device with thermally conductive plate
Stephen Charles Davies, El Dorado Hills, CA (US); Wojtek Sudol, Andover, MA (US); William John Ossmann, Acton, MA (US); Anjali Saini, Sudbury, MA (US); and Mike Lavy, Stoneham, MA (US)
Assigned to PHILIPS IMAGE GUIDED THERAPY CORPORATION, San Diego, CA (US)
Filed by PHILIPS IMAGE GUIDED THERAPY CORPORATION, San Diego, CA (US)
Filed on Aug. 28, 2023, as Appl. No. 18/238,555.
Application 18/238,555 is a continuation of application No. 16/489,857, granted, now 11,737,728, previously published as PCT/EP2018/054805, filed on Feb. 27, 2018.
Claims priority of provisional application 62/468,046, filed on Mar. 7, 2017.
Prior Publication US 2023/0397904 A1, Dec. 14, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. A61B 8/00 (2006.01); A61B 8/12 (2006.01); A61M 25/00 (2006.01); A61M 25/01 (2006.01)
CPC A61B 8/445 (2013.01) [A61B 8/12 (2013.01); A61B 8/4488 (2013.01); A61B 8/4494 (2013.01); A61B 8/546 (2013.01); A61M 25/0009 (2013.01); A61M 25/0108 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a flexible elongate member configured to be positioned within a body lumen of a patient; and
an imaging assembly disposed at a distal portion of the flexible elongate member, wherein the imaging assembly comprises:
an array of imaging elements;
an integrated circuit comprising a bottom surface and an opposite, top surface; and
an interconnect board comprising a bottom surface and an opposite, top surface; and
a thermally conductive plate coupled to the integrated circuit and the interconnect board, wherein the thermally conductive plate comprises a bottom surface and an opposite, top surface,
wherein the bottom surface of the integrated circuit is disposed over a first section of the top surface of the thermally conductive plate, and
wherein the bottom surface of the interconnect board is disposed over a second section of the top surface of the thermally conductive plate.