US 12,477,932 B2
Display substrate and preparation method thereof, and display apparatus each including partition region provides with at least one partition dam surrounding function hole
Nan Du, Beijing (CN); Guowei Su, Beijing (CN); ChiehHsing Chung, Beijing (CN); Yongyi Fu, Beijing (CN); Yong Zhou, Beijing (CN); Feng Bai, Beijing (CN); Saijun Sun, Beijing (CN); Kaihao Chen, Beijing (CN); Suoping Peng, Beijing (CN); Kechao Song, Beijing (CN); Zhengping Xu, Beijing (CN); Sa Liu, Beijing (CN); and Hexiong Li, Beijing (CN)
Assigned to Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and Beijing BOE Technology Development Co., Ltd., Beijing (CN)
Appl. No. 17/913,172
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Nov. 29, 2021, PCT No. PCT/CN2021/134057
§ 371(c)(1), (2) Date Sep. 21, 2022,
PCT Pub. No. WO2023/092566, PCT Pub. Date Jun. 1, 2023.
Prior Publication US 2024/0224716 A1, Jul. 4, 2024
Int. Cl. H10K 59/80 (2023.01); H10K 59/12 (2023.01)
CPC H10K 59/873 (2023.02) [H10K 59/1201 (2023.02)] 17 Claims
OG exemplary drawing
 
1. A display substrate, comprising a display region and at least one hole region located in the display region, wherein the hole region comprises a function hole and a partition region surrounding the function hole, and the partition region is provided with at least one partition dam surrounding the function hole; the partition dam comprises a first partition layer disposed on a base substrate and a second partition layer disposed on a side of the first partition layer away from the base substrate, at least one partition layer of the first partition layer and the second partition layer comprises a second sub-layer and a third sub-layer disposed on a side of the second sub-layer away from the base substrate, the third sub-layer has a protrusion with respect to a sidewall of the second sub-layer, the protrusion and the sidewall of the second sub-layer form an inwardly recessed structure,
wherein the at least one partition layer further comprises a first sub-layer, and the second sub-layer is disposed on a side of the first sub-layer away from the base substrate, and
wherein the first partition layer comprises a first conductive sub-layer, a second conductive sub-layer disposed on a side of the first conductive sub-layer away from the base substrate, and a third conductive sub-layer disposed on a side of the second conductive sub-layer away from the base substrate; along a direction away from the function hole, a width of the second conductive sub-layer is smaller than each of widths of the first conductive sub-layer and the third conductive sub-layer, an orthographic projection of the second conductive sub-layer on the base substrate is within each of a range of an orthographic projection of the first conductive sub-layer and a range of an orthographic projection of the third conductive sub-layer on the base substrate, the first conductive sub-layer and the third conductive sub-layer have protrusions with respect to a sidewall of the second conductive sub-layer, and the protrusions and the sidewall of the second conductive sub-layer form an inwardly recessed structure.