| CPC H10K 59/131 (2023.02) [H10K 59/1213 (2023.02)] | 18 Claims |

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1. A display substrate, comprising:
a base substrate, comprising a display region and a display peripheral region surrounding the display region, wherein the display peripheral region comprises a first bonding region, a bonding boundary region and a bonding peripheral region, the first bonding region comprises the bonding boundary region, the bonding peripheral region surrounds the bonding boundary region;
a plurality of data lines, located in the display region and extending to the first bonding region;
a plurality of contact pads, located in the first bonding region and configured to be electrically connected to the plurality of data lines;
a first insulation laminated layer, in the first bonding region; and
a second insulation laminated layer, in the bonding peripheral region, wherein the second insulation laminated layer extend into the first bonding region to obtain the first insulation laminated layer; and
wherein a thickness of the first insulation laminated layer along a direction perpendicular to the base substrate is smaller than a thickness of the second insulation laminated layer along the direction perpendicular to the base substrate,
wherein the display peripheral region further comprises a transition region, and the transition region is located between the display region and the first bonding region,
the display substrate further comprises a third insulation laminated layer, in the transition region, wherein the third insulation laminated layer comprises a first insulation laminated sub-layer and a second insulation laminated sub-layer, an orthographic projection of the first insulation laminated sub-layer on the base substrate at least partially covers the transition region and the bonding peripheral region, and an orthographic projection of the second insulation laminated sub-layer on the base substrate at least partially covers the transition region and the bonding peripheral region,
wherein the third insulation laminated layer further comprises a third insulation laminated sub-layer that is between the first insulation laminated sub-layer and the second insulation laminated sub-layer, and
an orthographic projection of the third insulation laminated sub-layer on the base substrate does not overlap with the first bonding region and the bonding peripheral region.
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