US 12,477,875 B2
Light emitting diode (LED) package having reflection molding layer covering led chip
Jongho Lim, Suwon-si (KR); Jaehyuk Lim, Hwaseong-si (KR); Hosik Jun, Hwaseong-si (KR); Hyojeong Kang, Hwaseong-si (KR); and Yonggi Cho, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Sep. 13, 2022, as Appl. No. 17/943,299.
Claims priority of application No. 10-2021-0158037 (KR), filed on Nov. 16, 2021.
Prior Publication US 2023/0155086 A1, May 18, 2023
Int. Cl. H10H 20/856 (2025.01); H01L 25/16 (2023.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01)
CPC H10H 20/856 (2025.01) [H01L 25/167 (2013.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/855 (2025.01); H10H 20/0361 (2025.01); H10H 20/0363 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A light-emitting diode (LED) package, comprising:
a substrate including an insulating material;
upper pads on an upper surface of the substrate;
a side surface molding layer covering the upper surface of the substrate and side surfaces of the upper pads;
an LED chip on the upper surface of the substrate and electrically connected to the upper pads;
a fluorescent layer on the LED chip; and
a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon,
wherein the reflection molding layer exposes a portion of side surfaces of the fluorescent layer,
wherein the reflection molding layer has an upper surface configured to reflect light emitted from the exposed portion of the side surfaces of the fluorescent layer, and
wherein an uppermost portion of the upper surface of the reflection molding layer is farther from the upper surface of the substrate in a vertical direction than an upper surface of the fluorescent layer.