US 12,477,870 B2
Surface mountable optoelectronic device with side walls including slots filled with a laminated encapsulant material
Low Tek Beng, Melaka (MY); and Lim Chee Sheng, Melaka (MY)
Assigned to DOMINANT OPTO TECHNOLOGIES SDN BHD., Melaka (MY)
Filed by Dominant Opto Technologies Sdn Bhd., Melaka (MY)
Filed on Jun. 7, 2022, as Appl. No. 17/834,862.
Claims priority of application No. PI 2022001857 (MY), filed on Apr. 7, 2022.
Prior Publication US 2023/0327056 A1, Oct. 12, 2023
Int. Cl. H10H 20/85 (2025.01); H01L 23/04 (2006.01); H01L 23/043 (2006.01); H01L 23/053 (2006.01); H10H 20/01 (2025.01); H10H 20/853 (2025.01); H10H 20/857 (2025.01)
CPC H10H 20/8506 (2025.01) [H10H 20/853 (2025.01); H10H 20/857 (2025.01); H01L 23/041 (2013.01); H01L 23/043 (2013.01); H01L 23/053 (2013.01); H10H 20/0362 (2025.01); H10H 20/0364 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A surface mount technology (SMT) optoelectronic device, comprising:
a substrate comprising electrical terminals that facilitate attachment and electrical coupling of the SMT optoelectronic device to a printed circuit board;
a housing comprising an opaque material and a cavity, wherein the substrate is positioned at a bottom portion of the cavity, and wherein a top portion of the housing comprises a group of slot openings that open into the cavity and extend from an interior of the housing to an exterior of the housing;
at least one optoelectronic chip that is
electrically connected to the electrical terminals, and
mounted, within the cavity, to the substrate; and
an encapsulant material that is translucent or transparent and that has been included in the cavity and the slot openings.