US 12,477,867 B2
Ultra-thin LED electrode assembly and method for manufacturing thereof
Young Rag Do, Seoul (KR)
Assigned to KOOKMIN UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATION, Seoul (KR)
Filed by KOOKMIN UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATION, Seoul (KR)
Filed on Dec. 29, 2021, as Appl. No. 17/564,488.
Claims priority of application No. 10-2021-0039000 (KR), filed on Mar. 25, 2021.
Prior Publication US 2022/0310878 A1, Sep. 29, 2022
Int. Cl. H10H 20/831 (2025.01); H10H 20/01 (2025.01); H10H 20/825 (2025.01); H10H 20/832 (2025.01)
CPC H10H 20/8312 (2025.01) [H10H 20/01 (2025.01); H10H 20/825 (2025.01); H10H 20/832 (2025.01); H10H 20/032 (2025.01)] 4 Claims
OG exemplary drawing
 
1. A method of manufacturing an ultra-thin LED electrode assembly, the method comprising:
(1) an operation of preparing a lower electrode line including a first electrode;
(2) an operation of treating an ink composition including a plurality of ultra-thin LED elements on the first electrode, wherein each ultra-thin LED element comprises each including a first conductive semiconductor layer, a photoactive layer, and a second conductive semiconductor layer which are stacked, and has a ratio of 1:0.5 to 1.5 between a thickness which is a stacking direction and a length of a long axis in a cross-section perpendicular to the stacking direction, and has a thickness of 2 μm or less and a maximum surface area of 4.0 μm2 or less which is a maximum value among areas of a vertical projection surface;
(3) an operation of assembling the ultra-thin LED elements to be upright in a thickness direction on the first electrode; and
(4) an operation of forming an upper electrode line including a second electrode to be electrically connected to a side opposite one side of each of the ultra-thin LED elements assembled on the first electrode.