| CPC H10H 20/018 (2025.01) | 9 Claims |
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1. A method to transfer a microdevice, the method comprising:
forming a micro device on a first substrate, the microdevice covered by a dielectric layer;
forming a release layer on top of the microdevice;
coupling a conductive layer to a microdevice contact through an opening in the dielectric layer;
bonding the microdevice to a second substrate through a bonding layer;
removing the microdevice from the first substrate;
patterning the dielectric layer to form anchors to hold the micro device;
removing the release layer creating a void only around part of the microdevice; and
transferring the micro device to a system substrate.
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