US 12,477,854 B2
Image sensor signal path routing
Nicholas Paul Cowley, Wroughton (GB); Andrew David Talbot, Chieveley (GB); and Stephen James Spinks, Shrivenham (GB)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Mar. 8, 2023, as Appl. No. 18/180,511.
Prior Publication US 2024/0304647 A1, Sep. 12, 2024
Int. Cl. H10F 39/00 (2025.01); H04N 25/633 (2023.01); H04N 25/702 (2023.01); H04N 25/703 (2023.01); H04N 25/78 (2023.01); H10F 39/18 (2025.01)
CPC H10F 39/811 (2025.01) [H04N 25/702 (2023.01); H04N 25/703 (2023.01); H04N 25/78 (2023.01); H10F 39/182 (2025.01); H04N 25/633 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor comprising:
an array of image sensor pixels having a first line of pixels and a second line of pixels;
a keep-out region that surrounds the array of image sensor pixels; and
a pixel signal path coupled to the first line of pixels, the pixel signal path having a first path portion that overlaps the keep-out region and a second path portion that overlaps at least one pixel in the second line of pixels.