US 12,477,849 B2
Fan-out package structure of image sensing device and manufacturing method thereof
Ching-Chao Lin, Hukou (TW)
Assigned to Powertech Technology Inc., Hsinchu (TW)
Filed by Powertech Technology Inc., Hukou (TW)
Filed on Jun. 1, 2023, as Appl. No. 18/327,449.
Claims priority of application No. 111123072 (TW), filed on Jun. 21, 2022.
Prior Publication US 2023/0411419 A1, Dec. 21, 2023
Int. Cl. H10F 39/00 (2025.01)
CPC H10F 39/804 (2025.01) [H10F 39/026 (2025.01); H10F 39/811 (2025.01)] 8 Claims
OG exemplary drawing
 
1. A fan-out package structure of an image sensing device comprising:
an image sensing unit including an image sensor, a spacer layer, and a light-transmitting cover plate, said image sensor having a sensing surface, a connecting surface opposite to said sensing surface, a plurality of through-silicon vias extending through said sensing surface and said connecting surface, and a plurality of conductive elements respectively disposed in said through-silicon vias and exposed from said connecting surface, said spacer layer being disposed on said sensing surface and surrounding a central portion of said sensing surface, said light-transmitting cover plate being disposed on said spacer layer spaced apart from and covering said sensing surface;
an image signal processor disposed on said connecting surface;
a redistribution layer covering said image signal processor and said connecting surface of said image sensor, and including a fan-out area extending outwardly from a bottom periphery of said image sensor, a metal circuit electrically connected to said image signal processor, and a plurality of conductive vias connected electrically and respectively to said conductive elements; and
an encapsulation layer that is disposed on said fan-out area, that surrounds and covers an outer periphery of said image sensing unit, and that allows a top surface of said light-transmitting cover plate to be exposed,
an electrical connection unit disposed on said redistribution layer at a side opposite to said fan-out area and electrically connected to said metal circuit and said conductive vias.