US 12,477,848 B2
Chip package and method for forming the same
Chia-Ming Cheng, New Taipei (TW); and Shu-Ming Chang, New Taipei (TW)
Assigned to XINTEC INC., Taoyuan (TW)
Filed by XINTEC INC., Taoyuan (TW)
Filed on Dec. 7, 2022, as Appl. No. 18/077,152.
Claims priority of provisional application 63/303,429, filed on Jan. 26, 2022.
Prior Publication US 2023/0238408 A1, Jul. 27, 2023
Int. Cl. H10F 39/00 (2025.01); H01L 23/00 (2006.01)
CPC H10F 39/804 (2025.01) [H10F 39/809 (2025.01); H10F 39/811 (2025.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A chip package, comprising:
a first semiconductor chip having a first surface and a second surface opposite the first surface;
a second semiconductor chip stacked on the second surface and having a third surface facing the second surface and a fourth surface opposite the third surface;
a first encapsulating layer surrounding the first semiconductor chip;
a second encapsulating layer surrounding the second semiconductor chip;
a first through-via penetrating through the first encapsulating layer; and
a second through-via, penetrating through the second encapsulating layer and electrically connected between the second semiconductor chip and the first through-via,
wherein the first surface is an active surface of the first semiconductor chip and the fourth surface is an active surface of the second semiconductor chip.