US 12,477,699 B2
Dual-mode datacenter cooling system with cooling loops and heat exchangers
Pardeep Shahi, Arlington, TX (US); and Ali Heydari, Napa, CA (US)
Assigned to NVIDIA Corporation, Santa Clara, CA (US)
Filed by NVIDIA Corporation, Santa Clara, CA (US)
Filed on Dec. 20, 2022, as Appl. No. 18/085,129.
Prior Publication US 2024/0215205 A1, Jun. 27, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20772 (2013.01) [H05K 7/20236 (2013.01); H05K 7/20254 (2013.01); H05K 7/20272 (2013.01); H05K 7/20781 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A system comprising: one or more first cooling loops comprising multiple first flow paths extending through multiple servers of multiple datacenter racks to cool one or more first components within the multiple servers having a first power density and one or more second cooling loops comprising multiple second flow paths extending through the multiple servers of the multiple datacenter racks to cool one or more second components within the multiple servers having a second power density, wherein a first cooling loop of the one or more first cooling loops flows first coolant into a server of the multiple servers in a first direction at a first side wall of the server at a first horizontal plane and out of the server in the first direction at a second side wall of the server opposite the first side wall at the first horizontal plane, and wherein a second cooling loop of the one or more second cooling loops flows second coolant into the server in the first direction at the first side wall at a second horizontal plane different from the first horizontal plane and out of the server in the first direction at the second side wall at the second horizontal plane, wherein the one or more first components are cooled by one or more associated cold plates of the one or more first cooling loops, wherein the first power density is greater than the second power density, and wherein the one or more cold plates are arranged in series.