US 12,477,688 B2
Systems and methods for cooling electronic devices
Danny J. Lohan, Northville, MI (US); Shailesh N. Joshi, Ann Arbor, MI (US); and Ercan M. Dede, Ann Arbor, MI (US)
Assigned to TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, TX (US); and TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP)
Filed by Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US)
Filed on Apr. 28, 2023, as Appl. No. 18/140,925.
Prior Publication US 2024/0365506 A1, Oct. 31, 2024
Int. Cl. H05K 7/20 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); H01L 23/427 (2006.01)
CPC H05K 7/2029 (2013.01) [F28D 15/025 (2013.01); F28D 15/0266 (2013.01); F28D 15/043 (2013.01); H01L 23/427 (2013.01); H05K 7/20327 (2013.01); H05K 7/20381 (2013.01); H05K 7/20809 (2013.01); H05K 7/20827 (2013.01); H05K 7/20836 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A system for cooling electronic devices, the system comprising:
a pump;
a distribution manifold fluidly coupled to the pump, wherein the distribution manifold is placed vertically above one or more capillary coolers and the one or more capillary coolers are fluidly coupled to the distribution manifold;
one or more of the electronic devices coupled to the one or more capillary coolers;
a vapor line fluidly coupled to the one or more capillary coolers; and
a condenser comprising an inlet and an outlet, wherein the inlet is fluidly coupled to the vapor line and the outlet is fluidly coupled to the pump.