US 12,477,685 B2
Server cooling using sprayed fluid and high conductivity gas or air
Hariharan Kumar, Sammamish, WA (US); and Husam Atallah Alissa, Snoqualmie, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on May 10, 2023, as Appl. No. 18/315,300.
Prior Publication US 2024/0381571 A1, Nov. 14, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20272 (2013.01) [H05K 7/20772 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A system for improving heat transfer for a data center, comprising:
a hermetically sealed container having sides defining an interior portion that is able to hold pressurized gas or air, wherein the hermetically sealed container encloses multiple data center computer servers within the interior portion, including a data center computer server; and
a spray device located within the interior portion for spraying a non-corrosive fluid in conjunction with pressurized gas or air over the data center computer server, located within the interior portion, to cool at least a portion of the data center computer server, wherein multiple spray devices are located on a side of each of the hermetically sealed container.