US 12,477,678 B2
Processor back-plate devices
Fu-Yi Chen, Taipei (TW); and Jui-Ming Chien, Taipei (TW)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 18/262,152
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jan. 29, 2021, PCT No. PCT/US2021/015767
§ 371(c)(1), (2) Date Jul. 19, 2023,
PCT Pub. No. WO2022/164446, PCT Pub. Date Aug. 4, 2022.
Prior Publication US 2024/0081014 A1, Mar. 7, 2024
Int. Cl. H05K 7/14 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/1402 (2013.01) [H05K 7/2039 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A device, comprising:
a locking mechanism to couple the device to a computing device enclosure;
a first portion at a first level to interact with a processor back-plate; and
a second portion at a second level to interact with an area proximate to the processor back-plate, wherein the second portion protrudes to the second level toward the processor back-plate when the device is coupled to the computing device enclosure and is to receive a heat sink.