US 12,477,672 B2
Support assembly, display module, and electronic device
Yujun Zhang, Shenzhen (CN); and Ning Guo, Shenzhen (CN)
Assigned to Honor Device Co., Ltd., Shenzhen (CN)
Appl. No. 18/271,469
Filed by Honor Device Co., Ltd., Shenzhen (CN)
PCT Filed Aug. 30, 2022, PCT No. PCT/CN2022/115824
§ 371(c)(1), (2) Date Jul. 10, 2023,
PCT Pub. No. WO2023/030313, PCT Pub. Date Mar. 9, 2023.
Claims priority of application No. 202111026467.X (CN), filed on Sep. 2, 2021.
Prior Publication US 2024/0057270 A1, Feb. 15, 2024
Int. Cl. H10K 30/80 (2023.01); H05K 5/02 (2006.01); H10K 102/00 (2023.01)
CPC H05K 5/0217 (2013.01) [H10K 30/80 (2023.02); H10K 2102/311 (2023.02)] 16 Claims
OG exemplary drawing
 
1. A support assembly, comprising:
a support plate, a first adhesive layer, a substrate, and a second adhesive layer, wherein the support plate, the first adhesive layer, the substrate, and the second adhesive layer are stacked in a stacking direction from a bottom up;
wherein the substrate is attached to the support plate by using the first adhesive layer, and the support assembly is configured to attach to another structure by using the second adhesive layer, thereby forming a display component of a foldable-screen device;
wherein the support assembly comprises a bendable region, the support assembly is configured to bend in the bendable region, the support assembly is provided with a plurality of first holes in an internally bendable region in the bendable region, the plurality of first holes are distributed at intervals in a first array, and the plurality of first holes penetrate through the support plate in the stacking direction;
wherein the support assembly is provided with a plurality of second holes in an externally bendable region in the bendable region, the plurality of second holes are distributed at intervals in a second array and formed in a first surface of the support plate opposite to a second surface of the support plate in contact with the first adhesive layer, wherein holes in the plurality of second holes have depth H in the stacking direction, wherein the depth H is less than a thickness B of the support plate in the stacking direction; and
wherein the support assembly is configured to bend, from an unfolded state towards a folded state, in the internally bendable region towards the second adhesive layer, and wherein the support assembly is configured to bend, from the unfolded state towards the folded state, in the externally bendable region towards the support plate.