US 12,477,658 B2
Electronic circuit manufacturing method for self-assembly to another electronic circuit
Alice Bond, Grenoble (FR); and Emilie Bourjot, Grenoble (FR)
Assigned to Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Paris (FR)
Filed by Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Paris (FR)
Filed on Aug. 25, 2022, as Appl. No. 17/895,263.
Claims priority of application No. 2108992 (FR), filed on Aug. 27, 2021.
Prior Publication US 2023/0061111 A1, Mar. 2, 2023
Int. Cl. H05K 3/10 (2006.01); H05K 3/26 (2006.01)
CPC H05K 3/107 (2013.01) [H05K 3/26 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic circuit extending along a main plane, the manufacturing method comprising:
a) a step of forming, by a damascene method by means of a pattern, an assembly site on a support, the assembly site being formed of an alternation of conductive pads made of a conductive material and of insulating posts made of a dielectric material flush with a first surface of the assembly site, the assembly site being delimited by insulating posts and surrounded with a peripheral area comprising a portion of the conductive material;
b) a step of forming a second etching mask entirely covering the assembly site;
c) a complementary step of etching, through the second etching mask, of the conductive material of the peripheral area, then a step of removal of the second etching mask, so that the assembly site forms a protrusion with respect to the support; and
d) assembling the assembly site of the electronic circuit using a self-assembly method including a hybrid bonding step to another assembly site of another electronic circuit manufactured according to steps a), b), and c).