US 12,477,655 B2
Compression attached memory module (CAMM) for low-power double data rate (LPDDR) memories
Arnold Thomas Schnell, Hutto, TX (US); and Joseph Daniel Mallory, Cedar Park, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by DELL PRODUCTS L.P., Round Rock, TX (US)
Filed on Jul. 11, 2022, as Appl. No. 17/861,856.
Application 17/861,856 is a continuation in part of application No. 17/656,662, filed on Mar. 28, 2022, granted, now 12,189,978.
Prior Publication US 2023/0309227 A1, Sep. 28, 2023
Int. Cl. H05K 1/14 (2006.01)
CPC H05K 1/145 (2013.01) 20 Claims
OG exemplary drawing
 
1. A memory module, comprising:
a printed circuit board including surface contact connections disposed on a first surface of the printed circuit board and located at a first portion of the printed circuit board, wherein a first set of the surface contact connections are arranged in first columns that are disposed at an acute angle with respect to second columns of a second set of the surface contact connections, a third set of the surface contact connections are arranged in third columns that are disposed at an opposite acute angle with respect to the second columns, the first set of the surface contact connections includes 61 of the surface contact connections that are associated with a first memory channel, the second set of surface contact connections includes 127 of the surface contact connections that are associated with the first memory channel and a second memory channel, and the third set of the surface contact connections includes 66 of the surface contact connections that are associated with the second memory channel; and
a first low-power double data rate (LPDDR) memory device disposed on a second surface of the printed circuit board and located at a second portion of the printed circuit board, wherein the first LPDDR memory device is configured to be coupled to an information handling system via the surface contact connections, and wherein the second portion of the printed circuit board is adjacent to the first portion of the printed circuit board.