US 12,477,654 B2
RF power pallet with management daughter board
Benone Achiriloaie, Riverside, CA (US)
Assigned to MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC., Lowell, MA (US)
Filed by MACOM Technology Solutions Holdings, Inc., Lowell, MA (US)
Filed on Apr. 1, 2022, as Appl. No. 17/711,509.
Prior Publication US 2023/0319995 A1, Oct. 5, 2023
Int. Cl. H05K 1/14 (2006.01); H01R 12/72 (2011.01); H05K 1/02 (2006.01)
CPC H05K 1/144 (2013.01) [H01R 12/721 (2013.01); H05K 1/024 (2013.01); H05K 1/141 (2013.01); H05K 2201/10098 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio frequency (RF) power pallet, comprising:
a first circuit board comprising a first side, a second side, a first metal layer, and a second metal layer;
an RF power amplifier electrically coupled to the first metal layer of the first circuit board; and
a second circuit board positioned over the first side of the first circuit board and electrically coupled to the first metal layer, the second circuit board comprising a bias voltage driver for a gate of the RF power amplifier, wherein:
the first circuit board comprises a first core material and the second circuit board comprises a second core material different than the first core material; and
the first metal layer of the first circuit board comprises a bias voltage trace that extends from the bias voltage driver and a contact of the second circuit board to the gate of the RF power amplifier.