US 12,477,652 B2
Circuit device
Chun-Yueh Hou, Hsin-Chu (TW); Hao-An Chuang, Hsin-Chu (TW); and Hsi-Hung Chen, Hsin-Chu (TW)
Assigned to AUO CORPORATION, Hsin-Chu (TW)
Filed by AUO Corporation, Hsin-Chu (TW)
Filed on Dec. 11, 2023, as Appl. No. 18/535,247.
Claims priority of application No. 112108591 (TW), filed on Mar. 8, 2023.
Prior Publication US 2024/0306294 A1, Sep. 12, 2024
Int. Cl. H05K 1/09 (2006.01); H05K 3/28 (2006.01); H10H 29/14 (2025.01)
CPC H05K 1/092 (2013.01) [H05K 3/28 (2013.01); H10H 29/142 (2025.01); H05K 2201/10128 (2013.01); H05K 2203/1377 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A circuit device, comprising:
a circuit substrate, having a first surface, a second surface opposite to the first surface, and a side surface, wherein a first turning region is provided between the first surface and the side surface, and a second turning region is provided between the second surface and the side surface, wherein the circuit substrate comprises:
a carrier plate; and
a first circuit structure, located on the carrier plate, and comprising a pad located on the first surface of the circuit substrate and an insulating structure surrounding the pad;
a protective layer, at least partially covering the first turning region and the second turning region, wherein a material of the protective layer comprises cured silver paste, epoxy resin or an acrylic-based insulating material; and
a side trace, located on the protective layer, and extending from the pad across the side surface of the circuit substrate to the second surface of the circuit substrate,
wherein the insulating structure has an opening overlapping with the pad and a broken surface located between the pad and the side surface of the circuit substrate, the side trace is at least partially filled in the opening to contact the pad, and the protective layer covers the broken surface.