US 12,477,651 B2
Method for manufacturing stretchable circuit board, metal-clad laminated sheet, metal foil with resin, stretchable circuit board, and stretchable circuit mounted article
Tomohiro Fukao, Osaka (JP); Tomoaki Sawada, Osaka (JP); Kyosuke Michigami, Hyogo (JP); and Qianying Li, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed on Jan. 11, 2024, as Appl. No. 18/410,564.
Application 18/410,564 is a continuation of application No. PCT/JP2022/022219, filed on May 31, 2022.
Claims priority of application No. 2021-150912 (JP), filed on Sep. 16, 2021.
Prior Publication US 2024/0147609 A1, May 2, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01)
CPC H05K 1/0283 (2013.01) [H05K 1/181 (2013.01); H05K 3/0058 (2013.01); H05K 3/0094 (2013.01); H05K 3/1283 (2013.01); H05K 2201/0212 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for manufacturing a stretchable circuit board, the method comprising:
preparing
a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less,
a second stretchable insulating layer, and
a fluid;
forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface;
filling the fluid in the via;
laminating the second stretchable insulating layer on the second surface to seal the via; and
patterning the metal layer.