US 12,477,582 B2
Uplink resource availability
Changhwan Park, San Diego, CA (US); Timo Ville Vintola, San Diego, CA (US); and Valentin Alexandru Gheorghiu, Yokohama (JP)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Nov. 7, 2022, as Appl. No. 18/053,354.
Claims priority of provisional application 63/266,514, filed on Jan. 6, 2022.
Prior Publication US 2023/0217496 A1, Jul. 6, 2023
Int. Cl. H04W 74/0808 (2024.01); H04W 72/0446 (2023.01); H04W 72/1268 (2023.01)
CPC H04W 74/0825 (2013.01) [H04W 72/0446 (2013.01); H04W 72/1268 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for wireless communications, comprising:
at least one memory comprising instructions; and
one or more processors configured to execute the instructions to cause the apparatus to:
obtain an uplink gap pattern (ULGP) configuration indicating a first ULGP associated with a first time window, wherein the first ULGP is indicative of a distribution of one or more uplink slots activated as uplink gaps within the first time window, and wherein the one or more uplink slots are independent from being used for any transmission initiated by the apparatus; and
output, for transmission, a first signal via a first uplink slot of the one or more uplink slots in response to a communication event corresponding to the first uplink slot.