US 12,476,842 B2
Direct encapsulation of sensor data over ethernet
Amir Bar-Niv, Sunnyvale, CA (US); and Dance Wu, Palo Alto, CA (US)
Assigned to Infineon Technologies Americas Corp., El Segundo, CA (US)
Filed by MARVELL ASIA PTE LTD, Singapore (SG)
Filed on Feb. 23, 2023, as Appl. No. 18/113,094.
Claims priority of provisional application 63/313,291, filed on Feb. 24, 2022.
Prior Publication US 2023/0269112 A1, Aug. 24, 2023
Int. Cl. H04L 12/40 (2006.01)
CPC H04L 12/40091 (2013.01) [H04L 12/40071 (2013.01); H04L 2012/40273 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A sensor bridge for use in an Ethernet network in a vehicle, the sensor bridge comprising:
a sensor interface, configured to receive sensor data from a sensor installed in the vehicle;
a mapper, configured to:
hold a direct mapping that maps specified parts of the sensor data to corresponding bit positions in one or more Ethernet packets; and
populate a memory buffer with the received sensor data in accordance with the direct mapping, wherein the memory buffer is preconfigured according to a format of the Ethernet packets and has respective memory locations designated to buffer the specified parts of the sensor data; and
a communication processor, configured to generate the one or more Ethernet packets comprising the sensor data buffered in the memory buffer, and to transmit the one or more Ethernet packets over the Ethernet network.