US 12,476,547 B2
Power conversion device with semiconductor temperature protection
Yuya Takahashi, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Nov. 30, 2022, as Appl. No. 18/072,233.
Claims priority of application No. 2022-103278 (JP), filed on Jun. 28, 2022.
Prior Publication US 2023/0421068 A1, Dec. 28, 2023
Int. Cl. H02M 3/00 (2006.01); H02M 1/32 (2007.01); H02M 3/335 (2006.01)
CPC H02M 3/33573 (2021.05) [H02M 1/327 (2021.05); H02M 3/003 (2021.05)] 18 Claims
OG exemplary drawing
 
1. A power conversion device, comprising:
a transformer having a primary winding and a secondary winding;
an inverter circuit that carries out a supply of power to the primary winding;
a rectifying circuit that rectifies power from the secondary winding;
a cooler that cools semiconductor elements configuring the inverter circuit and semiconductor elements configuring the rectifying circuit;
and a temperature detector that detects a temperature of the semiconductor elements configuring the inverter circuit and the semiconductor elements configuring the rectifying circuit, wherein
the cooler has a refrigerant channel along which a refrigerant is caused to circulate,
the inverter circuit, the rectifying circuit, and the temperature detector are disposed above the refrigerant channel when viewed in a cross-section,
and the temperature detector is disposed between or beside the inverter circuit and the rectifier circuit when viewed in a plan and is neighboring at least either one of the inverter circuit or the rectifying circuit,
wherein the inverter circuit and the rectifying circuit include a multiple of semiconductor elements, the inverter circuit includes a first semiconductor element whose distance to the temperature detector is shortest and a second semiconductor element whose distance to the temperature detector is longest among the multiple of semiconductor elements included in the inverter circuit,
the rectifying circuit includes a third semiconductor element whose distance to the temperature detector is shortest and a fourth semiconductor element whose distance to the temperature detector is longest among the multiple of semiconductor elements included in the rectifying circuit,
a distance between the first semiconductor element and the temperature detector is shorter than a distance between the second semiconductor element and the third semiconductor element, and a distance between the third semiconductor element and the temperature detector is shorter than a distance between the first semiconductor element and the fourth semiconductor element.