US 12,476,439 B2
Light-emitting component, light-emitting element array chip, and optical measurement apparatus
Takashi Kondo, Kanagawa (JP); Michiaki Murata, Kanagawa (JP); Junichiro Hayakawa, Kanagawa (JP); and Takafumi Higuchi, Kanagawa (JP)
Assigned to FUJIFILM Business Innovation Corp., Tokyo (JP)
Filed by FUJIFILM Business Innovation Corp., Tokyo (JP)
Filed on Aug. 25, 2021, as Appl. No. 17/411,337.
Claims priority of application No. 2021-074493 (JP), filed on Apr. 26, 2021.
Prior Publication US 2022/0344908 A1, Oct. 27, 2022
Int. Cl. H01S 5/42 (2006.01); G01S 7/4863 (2020.01); G01S 17/894 (2020.01); H01S 5/042 (2006.01)
CPC H01S 5/423 (2013.01) [G01S 7/4863 (2013.01); G01S 17/894 (2020.01); H01S 5/04256 (2019.08)] 12 Claims
OG exemplary drawing
 
1. A light-emitting component comprising:
a substrate;
a plurality of light-emitting elements that are disposed on the substrate and emit light in a direction perpendicular to a surface of the substrate; and
a gate electrode that is electrically connected to each of the plurality of light-emitting elements and performs control so that the plurality of light-emitting elements are switched ON/OFF together,
wherein a plurality of holes are disposed around each of the plurality of light-emitting elements.