| CPC H01R 13/41 (2013.01) [B23K 1/0016 (2013.01); H01R 13/2442 (2013.01); B23K 2101/36 (2018.08)] | 17 Claims |

|
1. A contact for mounting to a substrate, comprising:
an intermediate portion;
an upper contacting portion for engaging a conductive pad of an electronic module;
a lower securing portion for being fitted into a hole of the substrate, the lower securing portion being distinct from the upper contacting portion and having a body and a pair of resilient arms bent from the body; and
a leg extending downward from the lower securing portion; wherein
each resilient arm has a first section connected to the body and a second section angled relative to the first section; and
the pair of resilient arms form four abutting points for contacting the hole of the substrate, including a first abutting point defined at an intersection of the body and the first section of one resilient arm, a second abutting point defined at an intersection of the body and the first section of the other resilient arm, a third abutting point defined at a free end of the second section of one resilient arm, and a fourth abutting point defined at a free end of the second section of the other resilient arm.
|