US 12,476,399 B2
Array type connection structure and electronic device
Zhiyong Peng, Dongguan (CN); Jiayong Chen, Dongguan (CN); Baoliang Sun, Dongguan (CN); Wen Yu, Dongguan (CN); and Yinzhong Tang, Dongguan (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Jun. 16, 2023, as Appl. No. 18/336,059.
Application 18/336,059 is a continuation of application No. PCT/CN2021/138448, filed on Dec. 15, 2021.
Claims priority of application No. 202011492203.9 (CN), filed on Dec. 17, 2020; and application No. 202110814100.8 (CN), filed on Jul. 19, 2021.
Prior Publication US 2023/0335932 A1, Oct. 19, 2023
Int. Cl. H01R 12/72 (2011.01); H01R 12/67 (2011.01); H01R 13/533 (2006.01)
CPC H01R 12/724 (2013.01) [H01R 12/67 (2013.01); H01R 13/533 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An array type connection structure comprising: a support and a plurality of connecting assemblies, wherein
the support is configured to fasten the plurality of connecting assemblies that are arranged at intervals along a length direction of the support, wherein there is no signal cable routing in the support;
each of the connecting assemblies penetrates through the support;
a first side of each of the connecting assemblies has a connector interface, the connector interface comprises a plurality of first signal terminals, and the connector interface is configured to be connected to a first electronic component located on a first side of the support;
a second side of each of the connecting assemblies is directly connected to a plurality of cables, the plurality of cables are in an one-to-one correspondence with a plurality of second signal terminals of each of the connecting assemblies, and each of the cables is configured to be connected to a second electronic component located on a second side of the support; at least a part of the second signal terminals in the plurality of second signal terminals and at least a part of the first signal terminals in the plurality of first signal terminals are electrically connected in an one-to-one correspondence inside each of the connecting assemblies; and
the support is provided with a heat dissipation through hole, and the heat dissipation through hole is at least partially located between two adjacent connecting assemblies of the plurality of connecting assemblies.