US 12,476,210 B2
Bump structure and method of manufacturing bump structure
Ching-Yu Chang, Yuansun Village (TW); Ming-Da Cheng, Taoyuan (TW); and Ming-Hui Weng, New Taipei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 1, 2024, as Appl. No. 18/430,074.
Application 18/430,074 is a continuation of application No. 17/875,291, filed on Jul. 27, 2022, granted, now 11,923,326.
Application 17/875,291 is a continuation of application No. 17/019,173, filed on Sep. 11, 2020, granted, now 11,456,266, issued on Sep. 27, 2022.
Claims priority of provisional application 62/928,938, filed on Oct. 31, 2019.
Prior Publication US 2024/0258252 A1, Aug. 1, 2024
Int. Cl. H01L 23/00 (2006.01); C08G 73/10 (2006.01)
CPC H01L 24/05 (2013.01) [C08G 73/1078 (2013.01); C08G 73/1085 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/02251 (2013.01); H01L 2224/0226 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03616 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05176 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11452 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/1312 (2013.01); H01L 2224/13123 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13149 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/1316 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13171 (2013.01); H01L 2224/13179 (2013.01); H01L 2224/1318 (2013.01); H01L 2224/13181 (2013.01); H01L 2224/13184 (2013.01); H01L 2924/014 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/07025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A bump structure, comprising:
a passivation layer surrounding a metal pad structure;
a polyimide layer including a polyimide disposed over the passivation layer and the metal pad structure; and
a metal bump disposed over the metal pad structure and the polyimide layer,
wherein the metal bump is in electrical contact with the metal pad structure, and
the polyimide layer is adhered to the passivation layer and the metal pad structure by an adhesion promotor, wherein the adhesion promotor is chemically bonded to the polyimide, the passivation layer, and the metal pad structure.