US 12,476,202 B2
Semiconductor packages and associated methods with solder mask opening(s) for in-package ground and conformal coating contact
Avishesh Dhakal, Meridian, ID (US); and Gary A. Monroe, Plano, TX (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jan. 10, 2024, as Appl. No. 18/409,765.
Application 18/409,765 is a division of application No. 17/071,951, filed on Oct. 15, 2020, granted, now 11,908,805.
Application 17/071,951 is a continuation of application No. 16/234,068, filed on Dec. 27, 2018, granted, now 10,825,782, issued on Nov. 3, 2020.
Prior Publication US 2024/0145405 A1, May 2, 2024
Int. Cl. H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a semiconductor device, the method comprising:
forming a package substrate, the package substrate including a first surface having a die attach area, a second surface opposite the first surface, an opening in the second surface, and a ground plane positioned between the first surface and the second surface, the ground plane including a bottom surface facing the second surface and exposed through the opening and the second surface; and
applying a conformal coating over the package substrate such that (a) the conformal coating is positioned over a side of the first surface of the package substrate opposite the second surface and (b) the conformal coating extends along a side of the package substrate from the first surface to the opening in the second surface of the package substrate where a portion of the conformal coating is electrically connected to the ground plane through the opening in the second surface of the package substrate.