US 12,476,172 B2
Semiconductor device
Syunsuke Arai, Kariya (JP); Masayoshi Nishihata, Kariya (JP); Shinji Hiramitsu, Kariya (JP); and Noriyuki Kakimoto, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on May 18, 2022, as Appl. No. 17/747,629.
Application 17/747,629 is a continuation of application No. PCT/JP2020/038747, filed on Oct. 14, 2020.
Claims priority of application No. 2019-224847 (JP), filed on Dec. 12, 2019.
Prior Publication US 2022/0278030 A1, Sep. 1, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/49568 (2013.01) [H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 23/49562 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48245 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/182 (2013.01); H01L 2924/186 (2013.01); H01L 2924/30101 (2013.01); H01L 2924/30107 (2013.01); H05K 7/209 (2013.01); H05K 7/20936 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor element having two surfaces opposite to each other in a plate thickness direction and having a main electrode disposed on each of the two surfaces; and
a wiring member including a plurality of conducting parts and a joint part, the plurality of conducting parts including a set of heat dissipation parts and a plurality of terminal parts, the set of heat dissipation parts respectively disposed to the two surfaces to sandwich the semiconductor element and electrically connected to the main electrode disposed on corresponding one of the two surfaces, each of the plurality of terminal parts connected to one of the set of heat dissipation parts, the joint part formed by disposing a joint material between two conducting parts in the plurality of conducting parts in the plate thickness direction, wherein
in the joint part, a first conducting part as one of the two conducting parts has a high wettability region and a low wettability region in a surface opposite to a second conducting part as another one of the two conducting parts, the low wettability region is provided adjacent to the high wettability region so as to define an outer periphery of the high wettability region in planar view in the plate thickness direction and has wettability lower than the high wettability region to the joint material,
the high wettability region has an overlap region and a non-overlap region, the overlap region is a region overlapping a formation region of the joint part in the second conducting part in the planar view, the joint material is disposed in at least a part of the overlap region, and the non-overlap region is a region that is connected to the overlap region to be flush with the overlap region and does not overlap the formation region of the joint part in the second conducting part, and
the non-overlap region includes a holding region that is connected to the overlap region, and is entirely flush with the overlap region, wherein any surplus joint material is disposed in the holding region.