US 12,476,132 B2
Curved semiconductor die systems and related methods
Michael J. Seddon, Gilbert, AZ (US); and Francis J. Carney, Mesa, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on May 10, 2024, as Appl. No. 18/661,094.
Application 18/661,094 is a continuation of application No. 16/862,184, filed on Apr. 29, 2020, granted, now 12,020,972.
Prior Publication US 2024/0297065 A1, Sep. 5, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/32 (2006.01); H01L 23/538 (2006.01); H10F 39/00 (2025.01)
CPC H01L 21/6838 (2013.01) [H01L 23/32 (2013.01); H01L 23/5387 (2013.01); H01L 23/562 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a curved semiconductor die system, the method comprising:
coupling a die curvature support structure to a surface of a semiconductor die; and
inducing warpage in the surface of the semiconductor die through one of rotating or bending the die curvature support structure against the surface of the semiconductor die prior to directly bonding a second surface of the semiconductor die opposite the surface of the semiconductor die facing the die curvature support structure to a curved surface.