US 12,476,127 B2
Vacuum processing apparatus
Chen Pin Hsu, Tokyo (JP); Masatsugu Fujita, Tokyo (JP); Satoshi Yamamoto, Tokyo (JP); and Masakazu Isozaki, Tokyo (JP)
Assigned to Hitachi High-Tech Corporation, Tokyo (JP)
Appl. No. 18/025,453
Filed by Hitachi High-Tech Corporation, Tokyo (JP)
PCT Filed Mar. 15, 2022, PCT No. PCT/JP2022/011723
§ 371(c)(1), (2) Date Mar. 9, 2023,
PCT Pub. No. WO2023/175743, PCT Pub. Date Sep. 21, 2023.
Prior Publication US 2024/0297058 A1, Sep. 5, 2024
Int. Cl. H01L 21/673 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/67393 (2013.01) [H01L 21/67017 (2013.01); H01L 21/67769 (2013.01); H01L 21/67778 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A vacuum processing apparatus comprising: a vacuum processing unit embracing a vacuum vessel with a depressurized inside space into which a wafer to be processed is transferred and processed; a lock chamber into which the wafer before or after being processed is transferred; an atmospheric transfer unit with a casing embracing an atmospheric transfer chamber which is connected with the lock chamber and maintained at atmospheric pressure and inside which gas flows are formed from upward to downward and the wafer is transferred; and a wafer preserving container which embraces a processed wafer stacking space inside thereof, whose front end side is installed onto a wall surface of the casing, and whose interior communicates with the atmospheric transfer chamber via an opening located in the side wall,
wherein the wafer preserving container is provided inside with an exhaust port which is placed behind the opening, in front of the stacking space, and in an upper edge region and a lower edge region relative to the stacking space and exhausts gas in the stacking space to outside and a manifold which is placed behind the stacking space, towards the opening between the upper edge region and the lower edge region, and has gas outlets to supply certain gas into the stacking space.