US 12,476,121 B2
Transfer apparatus
Masahiro Dogome, Miyagi (JP); and Masatomo Kita, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Mar. 11, 2024, as Appl. No. 18/600,829.
Application 18/600,829 is a continuation of application No. 17/563,850, filed on Dec. 28, 2021, granted, now 11,948,816.
Claims priority of application No. 2020-219040 (JP), filed on Dec. 28, 2020.
Prior Publication US 2024/0213057 A1, Jun. 27, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67196 (2013.01) [H01L 21/67742 (2013.01); H01L 21/68764 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A transfer apparatus, comprising:
a first vacuum transfer module;
a first transfer robot disposed in the first vacuum transfer module;
a second vacuum transfer module;
a second transfer robot disposed in the second vacuum transfer module;
a connecting module disposed between the first vacuum transfer module and the second vacuum transfer module;
a wafer support disposed in the connecting module; and
a plurality of ring supporting members outwardly extending from the wafer support, the plurality of ring supporting members including a first ring supporting member and a second ring supporting member, the first ring supporting member extending into the first vacuum transfer module, the second ring supporting member extending into the second vacuum transfer module.