US 12,476,119 B2
Substrate processing apparatus and substrate processing method
Ki Sang Eum, Cheonan-si (KR); Dong Woon Park, Cheonan-si (KR); Young Jun Son, Cheonan-si (KR); Woo Ram Lee, Cheonan-si (KR); and Jin Ho Choi, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Nov. 30, 2023, as Appl. No. 18/523,893.
Claims priority of application No. 10-2022-0165523 (KR), filed on Dec. 1, 2022.
Prior Publication US 2024/0186155 A1, Jun. 6, 2024
Int. Cl. A47L 15/44 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67051 (2013.01) [H01L 21/6719 (2013.01); H01L 21/67196 (2013.01); H01L 21/67253 (2013.01); H01L 21/68785 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a processing container configured to form a processing space for a substrate;
a substrate support unit provided inside the processing space and configured to support the substrate;
a first nozzle member provided on a side of the substrate support unit inside the processing space and supplying a processing fluid toward a center area of a bottom surface of the substrate; and
a second nozzle member provided to be fixedly coupled to the substrate support unit and supplying a processing fluid toward an edge area of the bottom surface of the substrate,
wherein the first nozzle member is provided to rotate between a center position and an end position of the bottom surface of the substrate.