US 12,476,110 B2
Substrate processing module
Takashi Yamauchi, Kumamoto (JP); Shinichiro Kawakami, Kumamoto (JP); and Masashi Enomoto, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Apr. 24, 2024, as Appl. No. 18/644,661.
Application 18/644,661 is a continuation of application No. 17/969,878, filed on Oct. 20, 2022, granted, now 12,002,676.
Application 17/969,878 is a continuation of application No. 16/759,532, granted, now 11,508,580, previously published as PCT/JP2018/039225, filed on Oct. 22, 2018.
Claims priority of application No. 2017-208558 (JP), filed on Oct. 27, 2017.
Prior Publication US 2024/0274438 A1, Aug. 15, 2024
Int. Cl. H01L 21/033 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/0337 (2013.01) [H01L 21/0276 (2013.01); H01L 21/0332 (2013.01); H01L 21/0335 (2013.01); H01L 21/31144 (2013.01); H01L 21/6715 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A substrate processing module comprising:
a housing;
a stage disposed within the housing;
lifter pins disposed within the stage;
a driving unit configured to vertically move the lifter pins;
a gas supply;
a heater;
an exhaust unit; and
a controller configured to:
control the lifter pins so as to mount a substrate on the stage, the substrate including an under layer, a metal-containing resist pattern disposed on the under layer, and remaining metal components attached to an exposed portion of the under layer;
control the gas supply so as to supply a gas into the housing;
control the heater so as to heat the substrate mounted on the stage in a state that the gas is supplied into the housing, to thereby remove the exposed portion of the under layer and the remaining metal components; and
control the exhaust unit so as to exhaust at least one of the removed under layer film and the removed remaining metal components.
 
10. A substrate processing module comprising:
a housing;
a stage disposed within the housing;
lifter pins disposed within the stage;
a driving unit configured to vertically move the lifter pins so as to mount a substrate on the stage, the substrate including a under layer, a metal-containing resist pattern disposed on the under layer, and remaining metal components attached to an exposed portion of the under layer;
a gas supply configured to supply a gas into the housing;
a heater configured to heat the substrate mounted on the stage in a state that the gas is supplied into the housing, to thereby remove the exposed portion of the under layer and the remaining metal components; and
an exhaust unit configured to exhaust at least one of the removed under layer and the removed remaining metal components.