US 12,476,048 B2
Electronic component including accommodation part having opening
Takaaki Sato, Tokyo (JP); Akihiro Masuda, Tokyo (JP); Shinya Ito, Tokyo (JP); Norihisa Ando, Tokyo (JP); Hideki Kaneko, Tokyo (JP); Ken Aburakawa, Tokyo (JP); Kenya Tamaki, Tokyo (JP); and Akitoshi Yoshii, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Jan. 13, 2023, as Appl. No. 18/096,766.
Claims priority of application No. 2022-027092 (JP), filed on Feb. 24, 2022.
Prior Publication US 2023/0268127 A1, Aug. 24, 2023
Int. Cl. H01G 4/224 (2006.01); H01G 2/10 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 2/106 (2013.01); H01G 4/12 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electronic component comprising
a case including an accommodation part having an opening and an accommodation side wall surrounding a space inside the accommodation part;
a ceramic element arranged in the accommodation part;
a metal terminal including an electrode connecting part connecting to the ceramic element, a mounting part exposed out of the accommodation part, and a terminal arm part connecting the electrode connecting part and the mounting part;
a case cover including a closing plate part covering the opening, and a case cover lateral side portion extending in a depth direction of the accommodation part from a circumference of the closing plate part and at least partially facing against the accommodation side wall; and
a mold resin filling the accommodation part, wherein
an inner surface of the case cover lateral side portion faces an outer surface of the accommodation side wall in a direction perpendicular to the depth direction, and
a space is formed between the inner surface of the case cover lateral side portion and the outer surface of the accommodation side wall when viewed from a direction parallel to the depth direction.