US 12,476,042 B2
Coil device
Chen Wang, Tokyo (JP); Syun Ashizawa, Tokyo (JP); and Satoshi Sugimoto, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Mar. 1, 2024, as Appl. No. 18/593,402.
Application 18/593,402 is a continuation of application No. 17/404,146, filed on Aug. 17, 2021, granted, now 11,967,452.
Claims priority of application No. 2020-137581 (JP), filed on Aug. 17, 2020; and application No. 2021-121897 (JP), filed on Jul. 26, 2021.
Prior Publication US 2024/0203640 A1, Jun. 20, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 27/32 (2006.01); H01F 27/02 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 41/12 (2006.01)
CPC H01F 27/327 (2013.01) [H01F 27/02 (2013.01); H01F 27/24 (2013.01); H01F 27/2866 (2013.01); H01F 41/125 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A coil device comprising:
a first conductor;
a second conductor disposed inside the first conductor and at least partly extending along the first conductor;
a core for internally arranging the first conductor and the second conductor; and
an insulating layer formed at least between the first conductor and the second conductor, wherein
the insulating layer has a first part covering an outer surface of the second conductor, a second part covering an inner surface of the second conductor and a third part covering a side surface connecting the outer surface and the inner surface,
a gap is formed between the first part and an inner surface of the first conductor,
the first conductor has a pair of outer mounting parts at both ends, which can face a mounting surface,
the second conductor has a pair of inner mounting parts at both ends, which can face the mounting surface,
each of the inner mounting parts is arranged with an interval between each of the outer mounting parts, and
the inner mounting parts and the outer mounting parts are arranged with an interval between each inner mounting part and the corresponding outer mounting part.