US 12,476,024 B2
Superconducting wire, method for manufacturing superconducting wire, and MRI device
Hideki Tanaka, Tokyo (JP); Takaaki Suzuki, Tokyo (JP); and Motomune Kodama, Tokyo (JP)
Assigned to HITACHI, LTD., Tokyo (JP)
Appl. No. 17/785,142
Filed by HITACHI, LTD., Tokyo (JP)
PCT Filed Sep. 3, 2020, PCT No. PCT/JP2020/033426
§ 371(c)(1), (2) Date Jun. 14, 2022,
PCT Pub. No. WO2021/131166, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 2019-235787 (JP), filed on Dec. 26, 2019.
Prior Publication US 2023/0008754 A1, Jan. 12, 2023
Int. Cl. H01B 12/10 (2006.01); B21C 1/02 (2006.01); B22F 3/16 (2006.01); B22F 5/12 (2006.01); B22F 7/04 (2006.01); G01R 33/3815 (2006.01); H01B 1/02 (2006.01); H01F 6/06 (2006.01)
CPC H01B 12/10 (2013.01) [B21C 1/02 (2013.01); B22F 3/16 (2013.01); B22F 5/12 (2013.01); B22F 7/04 (2013.01); G01R 33/3815 (2013.01); H01B 1/02 (2013.01); H01F 6/06 (2013.01); B22F 2302/05 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A superconducting wire, comprising:
a filament formed of MgB2;
a base material covering a periphery of the filament;
a high-thermal expansion metal covering a periphery of the base material, the high-thermal expansion metal being stainless steel; and
a stabilizing material covering a periphery of the high-thermal expansion metal and stabilizing superconductivity, the stabilizing material being copper,
wherein the high-thermal expansion metal has a higher thermal expansion coefficient at room temperature than the MgB2 and the base material.