| CPC H01B 7/06 (2013.01) [A61B 5/6801 (2013.01); H05K 1/0283 (2013.01); A61B 2562/12 (2013.01); A61B 2562/164 (2013.01); H05K 2201/0133 (2013.01)] | 7 Claims |

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1. A microelectronic device comprising:
a microserpentine;
a substrate;
a plurality of microelectrodes associated with the microserpentine; and
an insulating layer,
wherein the microserpentine is disposed on the substrate,
wherein the plurality of microelectrodes extend out of plane from the microserpentine,
wherein the insulating layer is disposed on at least the microserpentine,
wherein the microserpentine comprises a core coated with a conductive coating,
wherein the microserpentine comprises a plurality of u-bends, each having a degree of completeness (α), wherein an α value of 0° corresponds to a semi-circular shape, and wherein an α value of +90° corresponds to a complete circle and −90° corresponds to a straight shape, and
wherein each of the plurality of u-bends has an α value of from about −35° to about 45°.
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