US 12,474,611 B2
Array substrate, liquid crystal display panel having the array substrate and liquid crystal display apparatus having the liquid crystal display panel
Jing He, Sichuan (CN); and Baohong Kang, Sichuan (CN)
Assigned to MIANYANG HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., Mianyang (CN); and HKC CORPORATION LIMITED, Shenzhen (CN)
Appl. No. 17/907,825
Filed by MIANYANG HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan (CN); and HKC CORPORATION LIMITED, Guangdong (CN)
PCT Filed Dec. 30, 2021, PCT No. PCT/CN2021/143353
§ 371(c)(1), (2) Date Aug. 29, 2022,
PCT Pub. No. WO2022/193786, PCT Pub. Date Sep. 22, 2022.
Claims priority of application No. 202110290698.5 (CN), filed on Mar. 18, 2021.
Prior Publication US 2024/0192553 A1, Jun. 13, 2024
Int. Cl. G02F 1/1345 (2006.01); G02F 1/1333 (2006.01); G02F 1/1339 (2006.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01)
CPC G02F 1/1345 (2013.01) [G02F 1/133345 (2013.01); G02F 1/1339 (2013.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01)] 17 Claims
OG exemplary drawing
 
1. An array substrate comprising a base substrate, a first metal pattern layer and a protection layer arranged as stacked in sequence; wherein the array substrate further comprises: a display area and a peripheral area surrounding the display area, the peripheral area comprises a bonding area and a non-bonding area, and the bonding area is disposed on at least one side outside the display area;
the first metal pattern layer comprises a plurality of conductive contacts disposed in the bonding area and arranged at intervals along a first direction and a plurality of signal leads disposed in the non-bonding area and having a bent shape, one terminal of each of the conductive contacts approaching the display area is connected with corresponding one of the signal leads, the conductive contacts extend along a second direction and are configured to bond with gold fingers on a circuit board to be bonded, the first direction is parallel to an edge of the display area most approaching the bonding area, and the second direction and the first direction are perpendicular to each other;
each of the signal leads comprises a second signal lead sub-portion extending along the first direction;
the protection layer comprises a first insulation layer and a second metal pattern layer arranged as stacked in sequence, and along a thickness direction of the base substrate, the first insulation layer is disposed on a side of the second metal pattern layer approaching the base substrate, wherein the second metal pattern layer is disposed in the non-bonding area, and the second metal pattern layer at least partially covers the signal leads;
wherein, each of the metal protection lines disposed on a side of the second signal lead sub-portions facing away from the base substrate comprises a plurality of sub-metal protection lines;
along the first direction, a length of a second interval region between adjacent two of the sub-metal protection lines is less than or equal to a length of a first internal region between adjacent two of the conductive contacts; and
wherein, the second interval region corresponding to different second signal lead sub-portions is located between extension lines of two edges of the first interval region parallel to the second direction;
wherein there are a plurality of second interval regions distributed between the extension lines of two edges, and each of the second interval regions corresponds to one second signal lead sub-portion;
wherein, along the thickness direction of the base substrate, a third metal pattern layer disposed in the bonding area is further provided on a side of the protection layer facing away from the base substrate; the third metal pattern layer is connected to the conductive contacts through through-holes provided in the protection layer, and the third metal pattern layer is configured to connect the conductive contacts with the gold fingers when the conductive contacts are bonded with the gold fingers; and
wherein the third metal pattern layer located in the bonding area is not in contact with the second metal pattern located in the non-bonding area.