US 12,474,533 B2
Electronic modules for co-packaged optics and copper packages
Amit Oren, Ramat Hasharon (IL); Barak Freedman, Binyamina (IL); and Casper Dietrich, Roskilde (DK)
Assigned to Mellanox Technologies, Ltd., Yokneam (IL)
Filed by Mellanox Technologies, Ltd., Yokneam (IL)
Filed on May 18, 2023, as Appl. No. 18/198,890.
Prior Publication US 2024/0385400 A1, Nov. 21, 2024
Int. Cl. H04B 10/00 (2013.01); G02B 6/42 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC G02B 6/4284 (2013.01) [G02B 6/4279 (2013.01); G02B 6/428 (2013.01); H01L 23/49816 (2013.01); H01L 24/81 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic module, comprising:
a multi-chip module (MCM) substrate having (i) a first surface comprising a ball grid array (BGA) configured to be connected to a system printed circuit board (PCB) and (ii) a second surface opposite the first surface, wherein the second surface defines a central portion and a peripheral portion, and wherein the MCM substrate comprises electrical traces;
a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with the electrical traces; and
a plurality of MCM sockets positioned on the peripheral portion of the MCM substrate, wherein each MCM socket of the plurality of MCM sockets is in electrical communication with the electrical traces of the MCM substrate and is configured to:
engage and support a mezzanine package substrate via a connector portion of the mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate, wherein the main portion of the mezzanine package substrate is larger than the connector portion of the mezzanine package substrate; and
electrically connect the mezzanine package substrate to the main die via at least one of the electrical traces of the MCM substrate.