US 12,474,526 B2
Managing photonic integrated circuit optical coupling
Jean-Philippe Bérubé, Saint-Augustin (CA); and Marie-Josee Picard, L'Ancienne-Lorette (CA)
Assigned to Ciena Corporation, Hanover, MD (US)
Filed by Ciena Corporation, Hanover, MD (US)
Filed on Mar. 3, 2023, as Appl. No. 18/177,844.
Prior Publication US 2024/0295697 A1, Sep. 5, 2024
Int. Cl. G02B 6/26 (2006.01)
CPC G02B 6/262 (2013.01) 20 Claims
OG exemplary drawing
 
1. An apparatus for coupling an external optical interface to a first optical interface of a photonic integrated circuit, the apparatus comprising:
a substrate comprising an optically transmissive material; and
a first optical waveguide core formed in proximity to a first surface of the substrate, the first optical waveguide core comprising
a first portion in optical communication with the external optical interface to couple optical waves between the first portion and the external optical interface,
a second portion that is (1) in proximity to the first surface of the substrate, and (2) adjacent to a second surface of the substrate at an acute angle with the first surface of the substrate and configured to reflect the optical waves before or after they propagate through the first surface of the substrate, and
a third portion between the first and second portions that is separated from the first surface of the substrate by a thickness of the optically transmissive material such that the second portion and the third portion have different respective distances to the first surface;
where the thickness of the optically transmissive material by which the third portion is separated from the first surface of the substrate is less than 0.1 microns, and/or the second portion of the first optical waveguide core is positioned less than 0.1 microns from the first optical interface of the photonic integrated circuit.