US 12,474,414 B2
System and method to monitor power source connections
Howard J. Haselhuhn, Jr., Brighton, MI (US)
Assigned to Allegro MicroSystems, LLC, Manchester, NH (US)
Filed by Allegro MicroSystems, LLC, Manchester, NH (US)
Filed on Jan. 4, 2024, as Appl. No. 18/404,172.
Prior Publication US 2025/0224458 A1, Jul. 10, 2025
Int. Cl. G01R 31/40 (2020.01); G01R 15/20 (2006.01)
CPC G01R 31/40 (2013.01) [G01R 15/20 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A current sensor integrated circuit (IC) comprising:
a lead frame comprising first primary current leads, second primary current leads and signal leads, wherein the first primary current leads form a first primary current path adapted to couple a first terminal of a first power source to a first terminal of a second power source and wherein the second primary current leads form a second primary current path adapted to couple a second terminal of the first power source and a second terminal of the second power source;
a semiconductor die supported by the lead frame;
at least one first magnetic field sensing element on the semiconductor die configured to generate a first magnetic field signal in response to a first magnetic field associated with a first current through the first primary current path;
at least one second magnetic field sensing element on the semiconductor die configured to generate a second magnetic field signal in response to a second magnetic field associated with a second current through the second primary current path; and
a current detection circuit on the semiconductor die and coupled to receive the first and second magnetic field signals, wherein the current detection circuit is configured to detect a fault in one or more of a plurality of electrical connections between the first primary current path and the first power source, between the first primary current path and the second power source, between the second primary current path and the first power source, or between the second primary current path and the second power source.