US 12,474,224 B2
Silicon piezoresistor force sensor
Brian Speldrich, Freeport, IL (US); and Richard Alan Davis, Plano, TX (US)
Assigned to Honeywell International Inc., Charlotte, NC (US)
Filed by Honeywell International Inc., Charlotte, NC (US)
Filed on Jan. 5, 2023, as Appl. No. 18/150,692.
Application 18/150,692 is a continuation of application No. 16/573,500, filed on Sep. 17, 2019, granted, now 11,573,136.
Application 16/573,500 is a continuation of application No. 15/388,483, filed on Dec. 22, 2016, abandoned.
Prior Publication US 2023/0146578 A1, May 11, 2023
Int. Cl. G01L 1/18 (2006.01); G01L 1/22 (2006.01)
CPC G01L 1/18 (2013.01) [G01L 1/2206 (2013.01); G01L 1/2293 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method of sensing a force using a sense die, the method comprising:
providing a slab die having a first surface and an opposing second surface with a contact area on the first surface;
applying an external force to the contact area of the slab die by contacting the slab die with a spherical actuation element, wherein the spherical actuation element creates a localized stress field along the first surface of the slab die adjacent the contact area;
determining a magnitude of the applied force via a plurality of sense elements;
identifying one or more high stress areas on the slab die based on the magnitude of the applied force, wherein the force at each of the one or more high stress areas is higher than the force at surrounding areas; and
positioning the plurality of sense elements about the contact area of the slab die based on a location of the one or more high stress areas such that a ratio of a width of the slab die to a first distance between two sensing elements of the plurality of sense elements measured across a center of the contact area is at least 2/1.